The Development Trend of SMT Industry

1. Manufacturing transformation and upgrading - SMT industry opportunities and challenges:

On the one hand, technological revolution: technological innovation of market terminal products has led to significant changes in the depth and breadth of the demand for SMT equipment—higher requirements have been placed on the complexity, accuracy, process and specifications of the manufacturing process; on the other hand, production factors such as labor With rising costs, OEM/EMS are faced with the dual demands of cost and efficiency. Improving automation level and reducing costs is a realistic requirement for the transformation and upgrading of manufacturing technology, which brings a strong driving force for new demand for SMT equipment.

2. The future development trend of SMT equipment technology:

The new technology revolution and cost pressure have given birth to the automated, intelligent and flexible manufacturing, assembly, logistics assembly, packaging, and testing integrated system MES. SMT equipment improves the automation level of the electronics industry through technological progress, realizes less labor, reduces labor costs, increases personal output, and maintains competitiveness, which is the main theme of SMT manufacturing. High performance, ease of use, flexibility and environmental protection are the main development trends of SMT equipment:

1). High precision and flexibility: industry competition is intensifying, new product launch cycles are shortening, and environmental protection requirements are more stringent; in line with the trend of lower costs and more miniaturization, higher requirements are placed on electronic manufacturing equipment. Electronic devices are developing in the direction of high precision, high speed and ease of use, more environmental protection and more flexibility. The function head of the patch head can realize any automatic switching; the patch head realizes dispensing, printing, and detection feedback, the stability of the placement accuracy will be higher, and the compatibility and flexibility of the parts and the substrate window will be stronger.

2). High speed and miniaturization: bring about high efficiency, low power, less space and low cost. The demand for high-speed and multi-function placement machines with excellent placement efficiency and multi-functionality is gradually increasing. The production mode of multi-track and multi-table placement can reach about 100,000 CPH.

3. The integration trend of semiconductor packaging and SMT: the volume of electronic products is becoming more and more miniaturized, the functions are becoming more and more diversified, and the components are becoming more and more sophisticated. The integration of semiconductor packaging and surface mount technology has become a general trend. Semiconductor manufacturers have begun to apply high-speed surface mount technology, and surface mount production lines have also integrated some applications of semiconductors, and the boundaries of traditional technical areas are becoming increasingly blurred. The integration and development of technology has also brought many products that have been recognized by the market. POP technology has been widely used in high-end smart products. Most brand mounter companies provide flip-chip equipment (direct application of wafer feeders), which provides a good solution for the integration of surface mount and semiconductor assembly.