1. YT202 adopts a high-speed universal integrated placement head, which can correspond to 0201 ultra-small chips to large components of 40*40mm, and the corresponding range is large

2. Adopt a new fixed flight recognition camera: improve the performance of recognition, the size of corresponding components for high-speed placement is enlarged by 40*40mm, and can recognize ball grid arrays such as BGA or CSP

3. Vacuum sensor device: Each suction nozzle has an independent detection function, which improves the stability of the equipment and the reliability of the product

4. Ultra-high-speed placement capability among products of the same level: By adopting high-end magnetic levitation, servo system and general-purpose placement technology, compared with traditional models, the placement capacity is increased by 25%, and the placement of 80,000CPH under the company's optimal conditions has been realized.