The overall reflow soldering includes: infrared convection, vapor phase reflow, hot plate reflow

Infrared convection: The average swarf is in the convection-type reflow process, except that the proportion of infrared radiant heat absorbed by the heating object is different. Infrared hot air reflow soldering is widely used, but in many cases, hot air reflow soldering is mainly used.

Gas phase reflow soldering: The vaporization released by the saturated vapor of an inert organic solvent when it is concentrated into a liquid is barely heated. It is required to have an organic solvent with a large heat transfer coefficient (the ozone layer is destroyed by a fluorinated liquid), the welding temperature is determined by the dot of the organic solvent, the temperature control is accurate, and the heating is rapid and uniform. The thermal shock is small.

Electric heating reflow soldering: heat conduction heating by electric heating, low thermal efficiency and uneven heating.