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SMT placement process

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—— Nadim

Cảm ơn bạn rất nhiềuETON vì đã giúp chúng tôi thiết kế toàn bộ chương trình dây chuyền sản xuất SMT, cho phép chúng tôi tiết kiệm chi phí. Cũng xin cảm ơn kỹ sư hậu mãi của công ty bạn đã đến nhà máy của chúng tôi để gỡ lỗi máy cá nhân, và dịch vụ này rất chuyên nghiệp và chu đáo. Hy vọng công ty của bạn ngày càng tốt hơn!

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—— tim

Çok fonksiyonlu bir makine ampul, lamba ve sürücü, çok akıllı sopa olabilir!

—— cagin

The HT-XF lamp high-speed placement machine is really amazing. The production capacity can reach 120,000 per hour. The speed is so fast but the accuracy is very high.

—— praveen

The machine is simple and easy to operate, and the service is very good. It also provides free software updates for life. ETON is a very good manufacturer

—— pawan

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SMT placement process
Latest company news about SMT placement process

The details in the SMT placement process determine the quality of PCB production. Simply put: customer orders - customer information - procurement of raw materials - incoming inspection - on-line production - packaging after-sales.

 

 

 Preparation before SMT SMT processing process

 

1. Circuit board data (Gerber) The standard circuit diagram electronic file should include at least 4 layers: PAD file, through hole file, text face file, solder mask file; preferably PCB board The board provided by the factory Gerber; standard board side specifications: 10mm board edge left and right; standard positioning hole specifications: one positioning hole on the left and right sides of the same board, the center of each side is 5mm diameter, 4mm round hole from both sides; standard visual mark point Specifications: 1mm solid tinned dot on the opposite side diagonal and 3mm diameter transparent ring on the outer ring.

 

2, material list (BOM) electronic file with position coordinates (CAD, text file with the extension ". TXT"); SMT front and back materials and DIP materials mixed list (please provide part coding principle and front and back parts resolution Method); SMT front and back materials are separated from DIP materials (please provide front and back part resolution); SMT front / SMT reverse / DIP materials separate list.

 

3. Auxiliary data Measuring furnace temperature board (including scrapping board of important parts); empty PCB board, Novo's electronics are generally used as Class A, PCB board; printed steel plate.

Pub Time : 2019-01-16 09:43:40 >> News list
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