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What challenges does high-density placement accuracy bring to SMT manufacturers?

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What challenges does high-density placement accuracy bring to SMT manufacturers?

What challenges does high-density placement accuracy bring to SMT manufacturers?

 

Pick and place machine

1. It is the improvement of the parts supply department of the placement machine, including the improvement of the position accuracy of the parts supply, the taping accuracy, and the packaging accuracy of the parts;

2. It is to determine the high rigidity of the part suction and placement motor shaft and the high precision of the drive system to improve the high ability of the position recognition system before the part placement;

3. The placement machine will not generate excess vibration during the placement process, and the device body has strong adaptability to external vibration and temperature changes;

4. It is to strengthen the automatic closed-loop calibration function of the placement machine. Most of the modern placement machines are developing in the direction of combining high-speed and high-precision motion control and vision correction systems.

 

Printing equipment

Since 75% of SMT defect rate lies in printing, high-density placement accuracy will bring greater challenges to printing and testing equipment manufacturers:

1. It is to ensure that the process requirements (0.66 demolding rate) will bring huge challenges to the thickness of the stencil and the amount of solder paste. At the same time, solder paste with a smaller powder diameter is required, which increases the cost on the one hand, and the solder paste is affected by the environment Affect the change in viscosity and cause printing difficulties;

2. It is the requirement of dust-free environment to increase the cost of exhaust system, air filtration system, auxiliary materials, anti-static floor, etc.

 

Reflow soldering equipment

Use nitrogen or vacuum welding; reflow and cooling wind speed control; precise refrigeration; small lateral temperature difference, timely temperature compensation, etc.

 

SPI, AOI-AXI

The balance between accuracy and speed of the equipment will face challenges, 3D inspection, 0 false positives and 0 missed inspections, and integrated control with production equipment.

Pub Time : 2021-07-07 13:55:11 >> News list
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