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What is SMT?

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—— Fikret

جودة الآلة ETon جيدة جدا وسريعة جدا، والآلات سهلة التشغيل. وكانت هناك خدمة ما بعد البيع، وكانت هناك تجربة ممتعة جدا للتسوق في الصين

—— Nadim

Cảm ơn bạn rất nhiềuETON vì đã giúp chúng tôi thiết kế toàn bộ chương trình dây chuyền sản xuất SMT, cho phép chúng tôi tiết kiệm chi phí. Cũng xin cảm ơn kỹ sư hậu mãi của công ty bạn đã đến nhà máy của chúng tôi để gỡ lỗi máy cá nhân, và dịch vụ này rất chuyên nghiệp và chu đáo. Hy vọng công ty của bạn ngày càng tốt hơn!

—— ngyum

ETON machine mounting speed is very fast, the quality is also very good, long life, after-sales service is very comprehensive, Worth having.

—— Sanjay

Thank you for your considerate service. You can reply my questions online 24 hours a day. The quality of your machines is very good.The installation plan you have given is excellent! Our productivity has improved, and we've had good revenues.We look forward to the opportunity to continue our cooperation.

—— tim

Çok fonksiyonlu bir makine ampul, lamba ve sürücü, çok akıllı sopa olabilir!

—— cagin

The HT-XF lamp high-speed placement machine is really amazing. The production capacity can reach 120,000 per hour. The speed is so fast but the accuracy is very high.

—— praveen

The machine is simple and easy to operate, and the service is very good. It also provides free software updates for life. ETON is a very good manufacturer

—— pawan

RT-1 hızlı ve yüksek hassasiyetli

—— abbas

The quality of your machines is very good, our company has been put into production

—— mohamed

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What is SMT?
Latest company news about What is SMT?

SMT is surface mount technology (short for Surface Mount Technology) and is currently the most popular technology and process in the electronics assembly industry.


SMT includes surface mount technology, surface mount equipment, surface mount components, and SMT management. Features: high assembly density, small size and light weight of electronic products. The size and weight of patch components are only about 1/10 of that of traditional plug-in components. After SMT is generally used, the volume of electronic products is reduced by 40%~60%, and the weight is reduced by 60%. %~80%. High reliability and strong anti-vibration ability. The solder joint defect rate is low. High frequency characteristics are good. Reduced electromagnetic and radio frequency interference. Easy to automate and increase productivity. Reduce costs by 30% to 50%. Save materials, energy, equipment, manpower, time, etc.


At present, the positioning of packaging technology has gradually evolved from general production technologies such as connection and assembly to a key technology for achieving highly diverse electronic information equipment. Higher density, smaller bumps, lead-free processes, etc. require new packaging technologies that are more adaptable to the rapidly changing needs of the consumer electronics market. The innovation of packaging technology has also become a powerful driving force for the continued development of semiconductor and electronic manufacturing technology, and has a significant impact on the improvement of semiconductor front-end technology and surface mount technology. If flip chip bump generation is an extension of the semiconductor front-end process to the back-end package, then silicon bond bump generation based on wire bonding is an extension of the packaging process.

Pub Time : 2019-01-09 11:13:32 >> News list
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