What is SMT?
SMT production line, Surface Mount Technology (SMT) is a new generation of electronic assembly technology developed by hybrid integrated circuit technology. It features a surface mount technology and reflow soldering technology to become a new generation in electronic product manufacturing. Assembly technology.
The wide application of SMT has promoted the miniaturization and multi-functionality of electronic products, providing conditions for mass production and low defect rate production. SMT is a surface assembly technology and is a new generation of electronic assembly technology developed by hybrid integrated circuit technology.
The main production equipment includes printing machines, dispensers, placement machines, reflow ovens and wave soldering machines. Auxiliary equipment includes testing equipment, rework equipment, cleaning equipment, drying equipment and material storage equipment.
The surface mount assembly process mainly includes the following steps: solder paste printing, component mount, and reflow soldering. The steps are summarized as follows:
Stencil Printing: solder paste is a follow-up material for the surface adhesive components and PCB to connect with each other. First, the steel plate is etched or laser cut, and then the solder paste is printed on the welding pad of PCB by the squeegee of the Printing machine, so as to enter the next step.
Component Placement: Component Placement is the key technology and work focus of the entire SMT process. The process USES highly precise automatic mounting equipment to accurately place the surface mount components on the solder pad of the printed PCB through computer programming.As the design of surface adhesive components is becoming more and more precise, the distance between the joints is becoming smaller, so the technical level difficulty of placement operation is increasing day by day.
Reflow Soldering,（Reflow Soldering) : Reflow Soldering is to have been placed on the surface of adhesive components of the PCB, after Reflow furnace first preheating with activated flux, to raise its temperature to 217 ℃ melt solder paste, feet and PCB Soldering pad connected components, then after cooling, cooling, make the solder curing, surface adhesive components and PCB bonding is completed.
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