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Development trend of LED placement machine (1)

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Development trend of LED placement machine (1)
Latest company news about Development trend of LED placement machine (1)

Development trend of LED placement machine (1)

LED placement machine is developing towards higher precision


The placement machine accuracy refers to the mechanical accuracy of the placement machine's X, Y axis navigation movement and the Z axis rotation accuracy. The placement machine adopts precise mechatronics technology to control the mechanical movement to grab the components from the feeder and place them on the circuit board precisely and reliably after being centered by the calibration mechanism. In order to produce products with higher performance, one of the first major challenges is to improve the placement accuracy of the placement machine as much as possible.

latest company news about Development trend of LED placement machine (1)  0

In common LED packaging technology, the connection between chip electrodes and support pins is generally achieved through interconnection with gold wires, but gold wire breakage has always been one of the common causes of failure. Abnormal gold wires in LED lighting applications are the culprit for common problems such as dead lights and large light decay. The dead light can be roughly divided into two situations, one is not bright at all, the other is not bright when it is hot, it is bright when it is cold, or flickering. The main reason for not lighting up is that the electrical circuit is open, and the reason for flickering is due to weak soldering or poor contact of the gold wire.

latest company news about Development trend of LED placement machine (1)  1

With the introduction of flip-chip soldering technology, the connection between the two can be connected through more stable metal bump solder balls, which saves costs and greatly improves reliability and heat dissipation. LED has the advantages of long life and other advantages. Compared with the traditional packaging technology using gold wire interconnection, the flip-chip welding technology can give full play to the advantages of LED. LED flip-chip welding technology realizes the single-chip and multi-chip modules. Die-bonding glue package has many advantages such as high brightness, high light efficiency, high reliability, low thermal resistance, and good color consistency.

latest company news about Development trend of LED placement machine (1)  2

LED gold-free packaging is commonly known as "no packaging" and "free packaging" in the industry. This process uses the direct SMT bonding of the flip chip and the circuit board, omits the SMD packaging process, and directly attaches the flip chip to the circuit board or the carrier by the SMT method, because the chip area is much smaller than the SMD device, so This process requires very sophisticated design.

In the future, the LED placement machine will be directly applied to the flip-chip non-encapsulation process on the basis of improving the accuracy. This will be a small revolution in the LED process, which can save a lot of packaging costs, and greatly increase the production cost and shorten the production cycle. It makes LED products really enter the general lighting market with high performance and low price. Applying the LED placement machine directly to the LED manufacturing process has the potential to become a future technology trend.


Pub Time : 2023-03-27 14:23:06 >> News list
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