Do you even know about X-ray?

Advantages and characteristics of X-RAY non-destructive ray inspection equipment:

X-RAY non-destructive ray detection equipment is X-ray perspective machine, the principle is to use the characteristics of X-ray energy to penetrate non-metallic substances.

Using the structure of a high-resolution enhanced screen and a sealed microfocus X-ray tube, through X-ray non-destructive fluoroscopic inspection, a clear internal picture of the product can be observed in real time. Check whether the lower parts of components such as BGA are well soldered and whether there is a short circuit, etc.

The rapid development of high-density packaging technology has also brought new challenges to testing technology. In order to meet the challenges, new testing technologies are constantly emerging, and X-ray testing technology is one of them, which can effectively control the quality of BGA soldering and assembly. Now X-ray inspection systems are not just used for laboratory failure analysis, they have been specially designed for PCB assembly in production environments and the semiconductor industry, providing high resolution X-ray systems.

The implementation goals of AXI non-destructive testing machine and X-ray optical detector:

X-RAY NDT inspection machine X-Ray inspection machine provides non-destructive testing solutions for PCBA, SMT assembly, semiconductor devices, batteries, automotive electronics, solar energy, LED packaging, hardware, wheel hubs and other industries.

Measurement range of X-ray ray detector: suitable for detecting various types of SMT chips, electronic chips, semiconductor chips, BGA, CSP, SMT, THT, Flip Chip and other components; , Whether the welding line is desoldering, virtual welding, missing welding, wrong welding, etc.).

Application fields of X-RAY testing equipment:

1. BGA welding inspection (bridge, open circuit, cold welding, void, etc.)

2. Interconnection of ultra-fine parts such as system LSI (disconnection, continuous welding)

3. Semiconductor testing of IC packaging, rectifier bridges, resistors, capacitors, connectors, etc.

4. PCBA welding condition detection

5. Perspective of the internal structure of hardware, electric heating pipes, pearls, heat sinks and lithium batteries