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Do you know that there are several classifications of placement machines?

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Do you know that there are several classifications of placement machines?
Latest company news about Do you know that there are several classifications of placement machines?

Do you know that there are several classifications of placement machines?


Pick and place machine, also known as "mounting machine", "surface mount system", it is configured after the glue dispenser or screen printing machine, is to accurately place the surface mount components on the PCB pads by moving the placement head A kind of equipment. It is a device used to place components at high speed and high precision. It is the most critical and complex device in the entire SMI and production. Mainly divided into two kinds of manual and automatic.


1. The working principle of the arch type placement machine:


First, the component feeder and the substrate are fixed, and the placement head moves back and forth between the feeder and the substrate to remove the components from the feeder, and then adjust the position and direction of the components, and finally paste Put it on the substrate.

The advantage is that the system has a simple structure, can achieve high precision, and is suitable for components of various sizes and shapes, and even special-shaped components. The feeder has the form of belt, tube, and tray. It is suitable for small and medium batch production, and can also be used for mass production by combining multiple machines.


2. The working principle of the turret type placement machine:


as shown in the figure below, the component feeder is placed on a single-coordinate moving cart, the substrate is placed on a worktable that moves in an X/Y coordinate system, and the placement head is installed on a turret. When working, the feeder moves the component feeder to the reclaiming position. The vacuum suction nozzle on the placement head takes the components at the reclaiming position and rotates to the placement position through the turret. During the rotation, it passes through the component position and Adjust the direction and place the components on the substrate.

Advantages: The speed is superior, suitable for mass production, but it can only use tape-packaged components, if it is a densely-footed, large-scale integrated circuit, only

Pub Time : 2021-10-12 19:56:12 >> News list
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