LED light SPI high precision

Solder Paste Inspection is a kind of SMT inspection equipment that uses the principle of optics to calculate the height of the solder paste printed on the PCB by triangulation. In fact, the solder paste thickness gauge and SPI are the same equipment, but in China, the offline solder paste thickness detection equipment is collectively referred to as “solder paste thickness gauge”, and the online solder paste thickness detection equipment is used to be called ” SPI”. Its function is to detect and analyze the quality of solder paste printing, and to detect SMT process defects early. Solder paste thickness test can be divided into 2D measurement and 3D measurement.