In what direction is the SMT machine developing?(2)

SMT equipment is developing in the direction of high precision, high speed and multi-function

As new chip components and their packaging methods are constantly changing, advanced packaging technologies are constantly emerging, and the requirements for placement machines are getting higher and higher.

For example, in order to improve the speed of SMT placement processing, all kinds of new placement machines generally use advanced technologies such as "laser alignment" and "flying alignment detection". That is to say, the placement head is running while the placement is performed, and the data tracking detection is performed at the same time, which greatly improves the centering speed of the placement machine.

For example, the placement speed of the CP40LV placement machine produced by Samsung Company in South Korea has reached 022 pieces, while the placement speed of the new CP4SFV placement machine is as high as 0.19 pieces/s. CP4SFV adopts the "new concept of suspension" and uses a "six-head six-view" structure camera to identify components, and each patch head can identify components independently, that is, the identification is completed during the suction and patch process. , so as to achieve a placement speed of 0.19 s.

Another example is Chip Scale Package (CSP), which requires the placement machine to have extremely high placement accuracy. 3D numerical control lighting can be used, the lighting level can be preset according to the shape of the component, and 16 levels of automatic programming control can be used. Illumination, so that part images can be accurately identified, and BGA or CSP can be identified.

Therefore, a new generation of SMT equipment is developing in the direction of high speed, high precision and multi-function. There is also a problem of how to ensure the high-precision and high-quality SMT work of SMT. In order to ensure the high precision of the placement machine, measures should be taken to reduce the vibration and jitter of the placement machine, reduce the weight of the body, and increase the rigidity of the equipment structure.

In order to ensure high-quality patch, the induction recognition technology of the best part of the component should be used to achieve no damage to the patch: the height distance of the suction nozzle, that is, the distance between the suction nozzle and the mounted printed circuit board, should be strictly controlled , The error of the X and Y axes of the nozzle position must be automatically corrected, so as to ensure the high-precision and high-quality placement of the placement machine.