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First, single-sided assembly
Incoming material inspection => screen printing solder paste (point patch adhesive) => patch => drying (curing) => reflow soldering =>
Cleaning => Detection => Repair
Second, double-sided assembly
A: incoming material inspection => PCB A-side silk screen solder paste (point patch adhesive) => patch => drying (curing) =>
A-side reflow soldering => cleaning => flap => PCB B-side silk screen solder paste (point patch adhesive) => patch =>
Drying => reflow soldering (preferably only for side B => cleaning => inspection => rework)
This process is suitable for use when a large SMD such as PLCC is attached to both sides of the PCB.
B: incoming material inspection => PCB A-side silk screen solder paste (point patch adhesive) => patch => drying (curing) =>
A-side reflow soldering => cleaning => flap => PCB B-side patch adhesive => patch => cure =>
B-face wave soldering => cleaning => detection => rework)
This process is suitable for reflow soldering on the A side of the PCB and B wave soldering on the B side. This process should be used in SMDs assembled on the B side of the PCB only when the SOT or SOIC (28) pins are below.
Factory Address:HENGFENG INDUSTRIAL AREA,ZHOUSHI ROAD NO. 739,HEZHOU COMMUNITY,HANGCHENG STREET,BAOAN,SHENZHEN,CHINA | |
Sales office:HENGFENG INDUSTRIAL AREA,ZHOUSHI ROAD NO. 739,HEZHOU COMMUNITY,HANGCHENG STREET,BAOAN,SHENZHEN,CHINA | |
+0086-136-70197725 | |
linda@eton-mounter.com | |