Third, single-sided mixing process

Incoming material inspection => PCB side A screen printing solder paste (point patch adhesive) => patch => drying (curing) => reflow soldering => cleaning => plug-in => wave soldering => cleaning => detection = > Rework

Four-sided double-mixing process

A: incoming inspection => PCB B-side patch adhesive => patch => curing => flap => PCB A-side plug-in => wave soldering => cleaning => detection => repair

Post-inserted

Suitable for SMD components more than discrete components

B: incoming material detection => PCB A-side plug-in (pin bending) => flap => PCB B-side patch adhesive => patch => cure => flap => wave soldering => cleaning => Detection => Rework

First insert and paste

Suitable for cases where the separation component is more than the SMD component

C: incoming material inspection => PCB A-side silk screen solder paste => patch => drying => reflow soldering => plug-in, pin bending => flap => PCB B-side patch adhesive => Patch => Cure => Flap => Wave Soldering => Cleaning => Detection => Rework

A side mixed, B side mounted

D: incoming material detection => PCB B-side point patch adhesive => patch => curing => flap => PCB A-side silk screen solder paste => patch => A-side reflow soldering => plug-in => B-side wave soldering => cleaning => detection => repair

First two-sided SMD, reflow soldering, post-insertion, wave soldering

E: incoming material inspection => PCB B-side silk screen solder paste (point patch adhesive) => patch => drying (curing) => reflow soldering => flap => PCB A-side silk screen solder paste => Patch => Drying => Reflow soldering 1 (local soldering can be used) => Plug-in => Wave soldering 2 (if there are few plug-in components, manual soldering can be used) => Cleaning => Detection => Rework

Five, double-sided assembly process

A: incoming material inspection, PCB A-side silk-screen solder paste (point paste), patch, drying (curing), A-side reflow soldering, cleaning, flipping; PCB B-side silk-screen solder paste (point patch) Glue), patch, dry, reflow soldering (preferably only for B side, cleaning, inspection, rework)

B: incoming material inspection, PCB A-side silk-screen solder paste (point paste), patch, drying (curing), A-side reflow soldering, cleaning, flipping; PCB B-side patch adhesive, patch , curing, B-side wave soldering, cleaning, inspection, rework)

This process is suitable for reflow soldering on the A side of the PCB and B wave soldering on the B side. SMD assembled on the B side of the PCB

This process should be used only when the SOT or SOIC (28) pins are below.