Fourth, consider direct packaging heat dissipation materials on LED packaging

Now developing and designing large-size LED backlight products, an important problem to be faced is the problem of heat dissipation. The direct-type LED large-size backlight source has a certain amount of light mixing height, which helps to dissipate heat to a certain extent, and a corresponding heat dissipation plate will be used on the entire LED large board to achieve heat dissipation effect.

Because the power of LED lamps is relatively high, and a certain amount of energy is released in the form of heat, and the backlight source has strict requirements on thermal reliability, overheating affects the performance of circuit components, reduces the luminous efficiency of LED lamps, and produces wrinkles in the film material. The phenomenon causes the backlight source mura (uneven, with spots) to be bad, the local temperature of the backlight source is overheated, and the liquid crystal work is unstable when the module is subjected to the aging test.

However, the large-size LED side-emitting backlight that is currently being developed for mass production requires a reduction in the number of light bars, an increase in the power of the lights, and a higher requirement for heat dissipation of the LED light bars. The current technology is that the light bar uses an aluminum substrate. The light bar needs a heat dissipation strip when it is assembled to the backlight, and the structure needs to cooperate better to dissipate heat. A challenge to existing technology.

Later trends focus on the luminous efficiency of LEDs. The higher the luminous efficiency, the lower the heat generated. From the perspective of LED lamp packaging technology, the heat dissipation material is directly packaged into the interior to achieve better heat dissipation effect. With the improvement of packaging technology, the heat dissipation of LED lamps will be better. And now various LED manufacturers are researching LED lamp modules. This technology is to encapsulate multiple chips under one module, and perform heat dissipation treatment accordingly. The light mixing in the Lightbar module achieves the best state, and it is better to use ceramic packaging. Heat dissipation, power improvement is developing towards 100lm/W.