Preparation before SMT placement machine

1. Prepare relevant product process documents.

2. Pick up materials (PCB, components) according to the mounting schedule of the product process documents and check them.

3. For PCBs that have been opened, clean and bake them according to the specific conditions such as the length of the unsealing time and whether they are damp or polluted.

4. Check the components after opening, and deal with the damp components in accordance with the management requirements of SMT process components.

5. According to the specifications and types of the components, select the feeder that escapes, and install the component tape feeder correctly. When loading -. You must align the center of the component with the pickup center of the feeder.

6. Equipment status check:

a. Check that the air pressure of the air compressor should meet the equipment requirements, generally 6kgjf/cm2 ~ 7kgf/cm2.

b. Check and make sure that there are no obstacles in the guide rail, the moving range of the placement head, around the automatic replacement nozzle library, and the pallet rack.