1. Equipment preparation and debugging

Before operation, it is necessary to check the power supply, air pressure, and stability of the guide rail of the equipment, ensure that the steel mesh of the printing machine is aligned with the PCB board, and evenly apply solder paste. The surface mount machine needs to calibrate the visual system, verify the component coordinate data, and avoid mounting offset.

2. Parameter settings

The printing machine needs to set the scraper pressure (usually 30-60N), speed (20-50mm/s), and mold release speed according to the type of solder paste; The surface mount machine needs to adjust the nozzle model, mounting height, and vacuum force to ensure that the components are picked up firmly.

3. Operation monitoring

During the production process, it is necessary to regularly check the thickness of solder paste printing (SPI testing) and the accuracy of surface mounting (AOI testing), promptly clean up any residue on the steel mesh, and prevent solder connection or missed printing. The surface mount machine needs to be regularly replenished with feeder materials to avoid missing parts.

4. Maintenance and upkeep

After daily shutdown, it is necessary to clean the debris inside the equipment, lubricate the moving parts, and regularly calibrate the sensors to extend their service life.