SMT is a surface assembly technology and is currently the most popular technology and process in the electronics assembly industry. SMT chip processing mainly refers to attaching components to a PCB printed with glue or solder paste through a bonding device, and then passing through the soldering furnace. Smt chip processing has been recognized by manufacturers for its high assembly density, small size of electronic products and good high frequency characteristics.

Because of the high efficiency and stable performance of SMT placement machine, it has brought great advantages to our production. With SMT placement machine, it can greatly improve production efficiency and provide high quality products to customers. SMT placement machine wants to be a patch robot, which is a relatively precise automated production equipment, so SMT placement machine operation precautions must be understood.

SMT chip processing operations and precautions:

1. Before using the SMT patch machine, you must first understand the common label of the placement machine;

2. Before the SMT placement machine is turned on, the operator should do a comprehensive inspection of the machine;

3, must strictly implement the SMT placement machine boot operation sequence; must have a detailed SMT placement machine operation instructions;

4. It is necessary to conduct regular troubleshooting and maintenance work on the SMT placement machine in a timely manner.

SMT chip processing advantages:

1. Small electronic products
The size of the chip component is only about 1/10 of that of the conventional plug-in component. After the SMT chip processing, the volume of the electronic product is reduced by 40% to 60%.
2, efficacy and low cost
SMT chip processing is easy to automate, improve production efficiency, save materials, energy, equipment, manpower, time, etc., and reduce costs by 30% to 50%.
3, light weight
The weight of the chip component is only 10% of that of the conventional plug-in component. After SMT is generally used, the weight is reduced by 60% to 80%.
4. High reliability and strong anti-vibration ability.
5, high frequency characteristics, reducing electromagnetic and radio frequency interference.
6. The solder joint defect rate is low.