Printing (red glue / solder paste) --> Inspection (optional AOI automatic or visual inspection) --> Mounting (first paste small device and then paste large devices: high-speed patch and integrated circuit placement) -- >Detection (optional AOI optical/visual inspection)-->welding (welding by hot air reflow) --> Inspection (can be divided into AOI optical inspection appearance and functional test) --> Maintenance (using tools: welding Table and hot air desoldering station, etc.) --> Sub-board (manual or split machine for cutting board)
The process flow is simplified to: printing ------- patch ------- welding ------- overhaul (testing can be added to each process to control quality)