The difference between SMT and DIP

DIP is the abbreviation of DOUBLE IN-LINE PACKAGE, dual in-line assembly.

SMT (SMD) is the surface assembly technology (abbreviation of SURFACE MOUNTED technology), which is a popular technology and process in the electronics assembly industry.

The difference between SMT and DIP

SMT patch is generally mounted with no-lead or short-lead surface assembly components. It is necessary to print solder paste on the circuit board, then mount it through a placement machine, and then fix the device through reflow soldering. The DIP welding is a direct-insertion packaged device, which is fixed by wave soldering or manual soldering.

Both SMT and DIP are part of PCBA processing, but not all PCBA factories have SMT and DIP post-welding capabilities, and the processing quality is also uneven. When choosing a PCBA factory for cooperation, it is recommended to go to the factory for on-site inspections to see the factory personnel skills, processing equipment, and the overall environment of the factory.

Also compared with the price of these two line, usually SMT line is higher than DIP. But SMT is the future trend. Cause SMT Line is more intelligent and more high quality. Also the components and product is smaller and smaller, that is what SMT could mounting but DIP couldn’t.

SMT technology have big development in the near future, much product who need high precision and need smaller finished product, SMT all are the best choose. Maybe the investment is bigger, but thinking about the future and the large market, SMT is always better than DIP.

However nowadays, In the big electrical factory, there are usually are both set up, SMT and DIP together for more complicated products. Technology are develop always, market also is changer always.

If you want to know more about SMT Line, please contact Joy: +8613590151025 (Whatsapp / wechat number)