The difference between wave soldering and reflow soldering:

The reflow soldering process is to remelt the paste-like solder pre-distributed on the printed board pad to realize the mechanical and electrical connection between the solder end of the surface mount component or the pin and the printed board pad.

With the enhancement of people's awareness of environmental protection, wave soldering has a new welding process. In the past, tin-lead alloy was used, but lead is a heavy metal that can cause great harm to the human body. So now there is the production of lead technology. It uses tin-silver-copper alloys and special fluxes, and the soldering temperature is higher. Higher preheating temperature is also necessary to set up a cooling zone workstation after the PCB board passes the soldering zone. This aspect is to prevent heat On the other hand, if there is ICT, it will have an impact on detection.

Wave soldering can basically be interpreted as: it is different from reflow soldering for soldering slightly larger and smaller components. However, reflow soldering heats the board and components, which is actually to liquefy the solder paste that was originally brushed on. , In order to achieve the purpose of connecting the component and the board.

1. Reflow soldering passes through the preheating zone, reflowing zone and cooling zone. In addition, wave soldering is suitable for manual boards and dispensing boards, and all components are required to be heat-resistant. The surface of the wave must not have components that used to be SMT solder paste. SMT solder paste boards can only be reflow soldered, not Use wave soldering.

2. Wave soldering is to melt the tin bar into liquid through the tin bath, and use the motor to stir to form a wave, so that the PCB and the parts can be welded together. It is generally used for the soldering of the hand plug-in and the smt glue board. Reflow soldering is mainly used in the SMT industry. It uses hot air or other heat radiation to melt the solder paste printed on the PCB and solder the parts.

3. The process is different: wave soldering must first spray flux, and then go through preheating, soldering and cooling zone.

The second difference between wave soldering and reflow soldering: Wave soldering is mainly used for soldering plug-ins; reflow soldering is mainly used for patch-type components

1. Wave soldering is to melt the tin bar into a liquid through a tin bath, and use the motor to agitate to form a wave, so that the PCB and the parts are welded together. It is generally used for the soldering of hand inserts and the glue board of SMT. Reflow soldering is mainly used in the SMT industry. It uses hot air or other heat radiation to melt the solder paste printed on the PCB and solder the parts.

2. The process is different: wave soldering must first spray flux, and then go through preheating, soldering, and cooling zone. The reflow soldering passes through the preheating zone, reflowing zone, and cooling zone. In addition, wave soldering is suitable for manual boards and dispensing boards, and all components are required to be heat-resistant. The surface of the wave must not have components that used to be SMT solder paste. SMT solder paste boards can only be reflow soldered. Wave soldering.