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the SMT mount component package form
SMT is an advanced electronic manufacturing technology, including packaging form and its outer packaging form.
Surface assembly components can be divided into passive components, active components and electromechanical components. Among them, the passive components are mainly packaged in the form of rectangular chip, cylindrical, special-shaped, composite chip, etc. The main components are surface assembly resistance, surface assembly capacitance and surface assembly inductance. The main packaging forms of active components are cylindrical, ceramic and plastic components, and the main components are various kinds of surface assembly discrete components and various packaging forms of surface assembly integrated devices; The main packaging form of electromechanical components is shaped.
There are four types of packaging for assembling electronic components on the surface: bulk packaging, braided packaging, tubular packaging, pallet packaging and packaging. Different components through different packaging methods through the placement machine nozzle to achieve the installation, in order to achieve the whole pcb patch processing process.
Factory Address:HENGFENG INDUSTRIAL AREA,ZHOUSHI ROAD NO. 739,HEZHOU COMMUNITY,HANGCHENG STREET,BAOAN,SHENZHEN,CHINA | |
Sales office:HENGFENG INDUSTRIAL AREA,ZHOUSHI ROAD NO. 739,HEZHOU COMMUNITY,HANGCHENG STREET,BAOAN,SHENZHEN,CHINA | |
+0086-136-70197725 | |
linda@eton-mounter.com | |