What are SMT and DIP?

1. SMT is the abbreviation of Surface Mount Technology and is currently the most popular technology and process in the electronics assembly industry. It is a circuit assembly technology in which surface mount components are mounted on the surface of a circuit board or the surface of other substrates, and are soldered and assembled by methods such as reflow soldering or dip soldering.

2. DIP, the abbreviation of Dual In-line Package, refers to a device packaged in a plug-in form, and the number of pins generally does not exceed 100. The frequently mentioned "DIP soldering" or "post-DIP soldering" refers to the soldering of DIP packaged devices after SMT.

The difference between SMT and DIP：

1. SMT patch is generally mounted with no-lead or short-lead surface assembly components. It is necessary to print solder paste on the circuit board, then mount it through a placement machine, and then fix the device through reflow soldering. The DIP welding is a direct-insertion packaged device, which is fixed by wave soldering or manual soldering.

2. Both SMT and DIP are part of PCBA processing, but not all PCBA factories have SMT and DIP post-welding capabilities, and the processing quality is also uneven. When choosing a PCBA factory for cooperation, it is recommended to go to the factory for on-site inspections to see the factory personnel technology, processing equipment, and the overall environment of the factory, etc.