Introduction and process of COB:

Introduction: Chip-on-board (COB), also known as Chip direct mount technology, refers to the naked chip is directly attached to the printed circuit Board. Then lead bonding is carried out, and the chip and lead are encapsulated and protected by organic glue. Compared with the conventional process, this process has high packing density and simple operation.

process : Clean PCB- DROP ADHESIVE - chip paste - test - seal vinyl heating curing - test - storage

What is SMT:

SMT (Surface Mounted Technology) is one of the most popular technologies and processes in the electronic assembly industry.

the characteristics of SMT:

1. High assembly density, small volume and light weight of electronic products, the volume and weight of patch components are only about 1/10 of the traditional plug-in components. Generally, after SMT, the volume and weight of electronic products are reduced by 40% and 60%

Reduce 60% ~ 80%.

2, high reliability, strong vibration resistance. Low defect rate of solder joints.

3. Good high-frequency characteristics. Reduced magnetic and RF interference.

4, easy to realize automation, improve production efficiency. Reduce the cost by 30%~50%. Save materials,Energy, equipment, manpower, time, etc.

Why use SMT:

1, the pursuit of miniaturization of electronic products, previously used perforated plug-in components can not be reduced

2, the electronic product function is more complete, the integrated circuit (IC) has no perforated components, especially large-scale, high integrated IC, has to use surface patch components.

3, product mass, production automation, the factory to low cost high output, produce quality products to meet customer needs and strengthen market competitiveness

4. The development of electronic components, the development of integrated circuits (IC), the multiple applications of semiconductor materials

5, the revolution of electronic science and technology is imperative, chasing the international trend