DIP is the abbreviation of DOUBLE IN-LINE PACKAGE, dual in-line assembly.
With the rapid development of SMT processing technology, SMT chip processing has gradually replaced DIP plug-in processing.However, due to the large size of some electronic components in PCBA production, plug-in processing has not been replaced, and still plays an important role in the process of electronic assembly.DIP plug-in processing in the SMT patch after processing, the general use of pipeline artificial plug-in, need a lot of staff.
What is the SMT ?
SMT (SMD) is the surface assembly technology (abbreviation of SURFACE MOUNTED technology), which is a popular technology and process in the electronics assembly industry.
The process flow of DIP plug-in processing can be generally divided into: component molding → plug-in → wave soldering → component cutting foot → repair welding (after welding) → plate washing → functional test
1. Pre-processing components
First of all, the staff of the pre-processing workshop collect the materials from the material place according to the BOM material list, carefully check the material model, specification, sign, and perform pre-production pre-processing according to the sample, using automatic bulk capacitor clipper, transistor automatic molding machine, and fully automatic Belt molding machine and other molding equipment for processing.
Insert the chip processed components into the corresponding position of PCB board to prepare for wave soldering.
3. Wave soldering
Put the plug-in PCB board into the wave soldering conveyor belt, and complete the soldering of the PCB board after spraying flux, preheating, wave soldering, cooling and other links.
4. Component cut foot
Cut the feet of the soldered PCBA board to achieve the appropriate size.
5. Repair welding (post welding)
For PCBA finished boards that have not been welded intact, they must be repaired and repaired.
6. Wash the plate
Clean the flux and other harmful substances remaining on the PCBA finished product to meet the environmental protection standard cleanliness required by customers.
7. Functional test
After the components are soldered, the finished PCBA board should be tested for function to test whether each function is normal. If the function defect is found, it should be repaired and tested again.
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