The Function of Solder Paste

Solder paste is a new type of welding material accompanied by SMT. It is a paste mixture formed by mixing solder powder, flux and other surfactants and thixotropic agents. Mainly used in SMT industry PCB surface resistance, capacitance, IC and other electronic components welding.

In the 1970s, Surface Mount Technology refers to printing and coating solder paste on the solder paste pad of printed circuit board, and accurately sticking the surface mount components on the solder paste pad, heating the circuit board according to a specific reflux temperature curve, so that the solder paste can melt. The alloy component is cooled and solidified to form solder joints between components and printed circuit boards to realize metallurgical connection technology.

Solder paste is a new kind of welding material accompanied by SMT. Solder paste is a complex system, is made of solder powder, flux and other additives mixed paste. The solder paste has a certain viscosity at room temperature, which can initially stick the electronic components in the established position. At the welding temperature, with the volatilization of solvent and some additives, the welded components and printed circuit pad will be welded together to form a permanent connection.