12 heads 45000 CPH LED Bulb Making Machine With Multifunctional

Product features

1. Single module magnetic linear motor multifunctional pick and place machine.
2. Mounting components:LED chip,capacitors, resistors,lens,IC,shaped components.etc.
3. Component-MIN size 0404,MAX height 15mm

2. Exclusive patented technology

1. Electronic feeder feeding system
2. Vision alignment flight identification,Mark correction.
3. Non-stop material re-loading function.
4. Auto-optimization after coordinates generated,etc.

3. Technical parameter

Company introduction

1. Shenzhen ETON Automation Equipment Co.,Ltd. -----Manufacturer of SMT automatic pick and place machine.
2. Company five level management policy: sincere business, focus on R&D, manufacturing intentions, considerate service, customer trust.
3. Quality principle: Quality First, Client-oriented, Continuous Improvement!
4. ETON’s purpose: to create value for customers, creating benefits for society.
5. ETON Vision: Determined to become the world’s most competitive manufacturer and service provider of pick and place machine and high-end electronic testing equipment.

• After sales service

• “No worries’’ after sale service concept: the Pearl River Delta region to arrive within 4 hours, day to solve; Guangdong Province 24 hours.
• Maintenance period:1 year.
• Visit customers regularly and gather information.
• Provide latest information about technology and equipment.

The advantages of SMT patches are as follows:

1. Small size and light weight

The volume and weight of SMT components are only about 1/10 of those of traditional plug-in components, which is convenient for mounting. Generally, after SMT chip processing, the volume of electronic products can be reduced by 40% to 60%, while the weight can also be reduced by 60% to 80%.

2. Increased efficiency and reduced costs

SMT patch processing is easy to achieve automation, improve production efficiency, save materials, energy, equipment, manpower, time, etc., and reduce costs by 30% to 50%.

3. High reliability and strong seismic resistance

4.Good high-frequency characteristics, reducing electromagnetic and radio frequency interference

5. Low solder joint defect rate

6. High mounting density