Automatic Vision Stencil Solder Paste Printer Machine Top Flattened Side Clamping

ET-5235 Automatic Vision Stencil solder paste printer machine

Machine Function

Automatic printing solder paste on the PCB by the stencil

Machine features

1. Graphic alignment: Align the optical positioning points (MARK points) of the substrate and the stencil on the worktable with the camera of the printer, and then finely adjust the X, Y, and Θ of the substrate and the stencil to make the substrate pads. The graphics coincide with the stencil opening graphics.

2. The angle of the scraper and the stencil: The smaller the angle between the scraper and the stencil, the greater the downward pressure, and it is easy to inject the solder paste into the mesh, but it is also easy to squeeze the solder paste to the bottom of the stencil, causing Solder paste sticking. Generally 45~60°. At present, most automatic and semi-automatic printing machines use 60°

3. The amount of solder paste input (rolling diameter): the rolling diameter of the solder paste ∮h≈13~23mm is more appropriate. ∮ If h is too small, it is easy to cause leakage of solder paste and small amount of tin. ∮ If h is too large, too much solder paste will cause the solder paste to fail to form rolling motion at a certain printing speed, and the solder paste cannot be wiped clean, resulting in poor printing release. Maiming domestic solder paste printing machine service, after printing tin Poor printing such as thick paste; and too much solder paste exposed to air for a long time is detrimental to the quality of solder paste. During production, the operator checks the height of the solder paste strips on the stencil every half an hour, and moves the solder paste on the stencil beyond the length of the squeegee to the front of the stencil with a Bakelite squeegee every half an hour and distributes the tin evenly. paste

4. Squeegee pressure: Squeegee pressure is also an important factor affecting printing quality, Moaning domestic solder paste printing machine service. The squeegee pressure actually refers to the depth of the squeegee's descent. If the pressure is too small, the squeegee does not stick to the surface of the stencil, so it is equivalent to increasing the printing thickness. In addition, if the pressure is too small, a layer of solder paste will remain on the surface of the stencil, which is likely to cause printing defects such as printing, forming and bonding.

Machine Parameter