pick and place machine in SMT production line in led light industrial for led tube mounting

pick and place machine in SMT production line in led light industrial for led tube mounting

Technical parameter

Dimension:2700*2300*1550mm

Total Weight:1700kg

PCB Length Width:Max:1200*330mm Min:100*100mm

PCB Thickness:0.5-5mm

No.of Feeder:68pcs

No.of Head:34pcs

PCB Clamping:Adjustable pressure pneumatic

Mounting Mode:Group picking and separate placingseparate picking and separate placing

Software:R&D independently

Mounting Precision:±0.02mm

Mounting Height:<=5mm (Automatic Changing)

Mounting Speed:150000-180000 CPH

Components:LED,capacitors,resistors,rectifier etc.

Transmission Direction:Single direction (option)

lamp tube definition

LED lamp tube also commonly known as LED light tube, LED fluorescent lamp tube, LED fluorescent lamp, its light source uses LED as the luminous body. The traditional fluorescent lamp is also called fluorescent lamp, each end of the lamp has a filament, the lamp is heavy with a small amount of argon and thin mercury vapor, the inner wall of the lamp is coated with fluorescent powder, when the gas between the two filaments conducts electricity, it emits ultraviolet light, cause phosphor to emit visible light. Because of the heavy metal pollutant"Mercury", it makes the abandoned BTS lamp seriously pollute the environment. LED lamps, on the other hand, use light-emitting diode as their light source, making them brighter, more energy-efficient, longer-lasting and more environmentally friendly. LED bulbs are the same size as traditional fluorescent bulbs, with T5 bulbs, T8 bulbs, and T10 bulbs, each 0.6 m, p. 9m, 1.2 m, 1.5 m, 1.8 m, and 2.4 m in length.

Structure of led tube

The structure of the general LED lamp structure: LED aluminum tube + LEDPC cover + aluminum board Lamp holder + lamp head + drive + beads. All parts must be fully equipped in order to produce maximum light effect function.

SMT production line

SMT production line main equipment: Printing Machine, SMT machine (upper surface electronic component) , reflow soldering, plug-in, wave oven, test packaging. The widespread application of SMT has promoted the miniaturization and multi-function of electronic products, and provided conditions for the production of mass production and low defect rate products. SMT is the surface assembly technology, which is a new generation of electronic assembly technology developed from hybrid integrated circuit technology.

Prospect

With the development of IC packaging in the direction of high integration, high performance, multi-lead and narrow spacing, it promotes the application of SMT technology in high-end electronic products, there are many technical difficulties. Since 1998, BGA devices have been widely used, especially in the communication industry. The proportion of BGA devices has been increasing rapidly. At the same time, SMT technology is driven by high-end products such as communication, entered a rapid, good development period.