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3000mm Length SMT Reflow Oven Hot Air Heating For Molting Solder Paste

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China Shenzhen Eton Automation Equipment Co., Ltd. certification
China Shenzhen Eton Automation Equipment Co., Ltd. certification
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3000mm Length SMT Reflow Oven Hot Air Heating For Molting Solder Paste

3000mm Length SMT Reflow Oven Hot Air Heating For Molting Solder Paste
3000mm Length SMT Reflow Oven Hot Air Heating For Molting Solder Paste 3000mm Length SMT Reflow Oven Hot Air Heating For Molting Solder Paste 3000mm Length SMT Reflow Oven Hot Air Heating For Molting Solder Paste 3000mm Length SMT Reflow Oven Hot Air Heating For Molting Solder Paste

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Product Details:
Place of Origin: CHINA
Brand Name: ETON
Certification: CCC,SIRA,CE
Model Number: ET-R8
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Packaging Details: We use vacuum wooden box packaging
Delivery Time: 5-8days
Payment Terms: L/C, T/T
Supply Ability: 50pcs/month
Detailed Product Description
Number Of Heating Zones: Upper 8 Hot Air Heating, Lower 8 Hot Air Heating Length Of Heating Zone: 3000mm
Heating Method: Hot Air PCB Maximum Width: 450mm (mesh)
Transport Direction: Left To Right Or Right To Left Conveyor Belt Height: Mesh Belt 880±20mm
High Light:

3000mm SMT Reflow Oven

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Solder Paste SMT Reflow Oven

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Hot Air SMT Reflow Oven

Reflow Oven of molten solder paste

 

Reflow Oven characteristics

Reflow Oven technology is no stranger in the field of electronic manufacturing. The components on various boards and cards used in our computers are welded to the circuit board through this process. There is a heating circuit inside this equipment, which heats the air or nitrogen to a sufficiently high temperature and blows it to the circuit board with the components pasted, so that the solder on both sides of the components melts and bonds with the motherboard. The advantage of this process is that the temperature is easy to control, oxidation can be avoided in the welding process, and the manufacturing cost is easier to control.

 

Development history of reflow soldering

According to the continuous improvement of heat transfer efficiency and welding reliability of products, reflow welding can be roughly divided into five development stages.

Fold first generation

Hot plate conduction reflow soldering equipment: the heat transfer efficiency is the slowest, 5-30 w/m2k (the heating efficiency of different materials is different), with shadow effect.

Fold second generation

Infrared thermal radiation reflow soldering equipment: the heat transfer efficiency is slow, 5-30w/m2k (the infrared radiation efficiency of different materials is different), there is a shadow effect, and the color of components has a great impact on the heat absorption.

Fold the third generation

Hot air reflow soldering equipment: high heat transfer efficiency, 10-50 w/m2k, no shadow effect, color has no effect on heat absorption.

3000mm Length SMT Reflow Oven Hot Air Heating For Molting Solder Paste 0

FAQ

Q:What is the delivery date?

We will deliver the goods after 30 days' deposit.

Q:Is electrical control developed independently?

Yes, the electrical control is by ourselves and have exclusive patent technology.

Q:Are you a manufacturer or trading company?

manufacturer. We have our own industrial park

 

Contact Details
Shenzhen Eton Automation Equipment Co., Ltd.

Contact Person: Ms. Linda

Tel: 0086 13670197725 (Whatsapp/Wechat)

Fax: 0086-755- 29502066

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